Electronics design and documentation for space missions

Requirements and system design, reliability analysis, testing and delivery for satellite and space-hardware teams.

01

From requirements to a delivered, documented board

We design electronics for space hardware across the full lifecycle, scaled to the mission: from automotive-grade parts for ground support and CubeSats to radiation-hardened design for GEO.

Full Lifecycle Support, Start to Finish

1
Phase 01

Requirements Analysis

  • System-Level design
  • SWaP Estimation
  • Problem and scope identification
  • Preliminary design proposals
2
Phase 02

Design & Reliability

  • Critical design review
  • Post-layout simulations
  • MTBF, DFMECA, PSA & WCA Package
  • Harness / GSE add-ons
3
Phase 03

Test Planning & Execution

  • Bring-up instructions
  • Performance testing
  • Burn-in execution
  • Environmental testing support
  • Serialized report package
4
Phase 04

Delivery

  • Product shipment
  • Post-delivery assistance
  • Certificate of Conformance
  • Final integration support

Tailored Solutions for an Ever-Changing Industry

01

General Electronics

  • Automotive-Grade silicon
  • IPC Class 2 design
  • Full lifecycle support
  • Gray room testing
Ground support equipment / CubeSat
02

Radiation-Tolerant Design

  • COTS + Mitigation
  • IPC Class 3 design
  • Reliability documentation package
  • Destructive SEL protection
  • IPC XX Inspection and workmanship
  • ISO 8 Cleanroom testing
LEO Missions – 2 to 5 years lifetime
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Radiation-Hardened Design

  • Rad-Hard critical components
  • IPC Class 3 design
  • Reliability documentation package
  • Non-Destructive SEL protection
  • IPC XX Inspection and workmanship
  • ISO 8 Cleanroom testing
GEO Missions – 5+ years lifetime
02

Reliability analysis and documentation

Phase 02 of every design includes a reliability package: MTBF prediction, FMECA, parts stress analysis and worst-case analysis.

What the reliability package contains

MTBF

Mean time between failures

Predicted failure rate for each part and for the whole board, under the mission's environment and temperature profile.

Example results coming soon
FMECA

Failure modes, effects and criticality analysis

How each part can fail, what each failure does to the system, and how critical that effect is.

Example results coming soon
PSA

Parts stress analysis

Electrical and thermal stress on every part, checked against derating limits.

Example results coming soon
WCA

Worst-case analysis

Circuit performance at the extremes of part tolerance, temperature, aging and radiation.

Example results coming soon
03

Revision / Systems

Content for this section is coming soon
World map highlighting the United States, Germany and Argentina, where ViaSol has offices.

Built Close to Where It Matters

With offices across the Americas and Europe, we are exactly where our partners need us.

Global reach, hands-on presence, wherever the mission is.

  • Colorado, USA
  • Münster, Germany
  • Buenos Aires, Argentina
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Tell us about your mission

Send us your requirements, orbit and timeline, and we'll reply by email.

Or write to us directly at info@viasol.space.